美国NDT BondHub Bond Testing C-scan
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Physical / Case Weight 25lb (11kg)
  Dimensions (W x H x D) 7.5in. x 18.0in. x 14.0in. (191mm x 457mm x 356mm)
  Operating Temperature 15 °F to 158 °F (-10 °C to 70 °C)
  Case Construction Integrated in Pelican Style case, vibration isolation
  Connector type USB, DVI, Multi-pin scanner connector
PC Processor 1GHz
  HDD 128GB Solid state
  Operating System Windows 7
  Peripherals Mini-keyboard with trackpad and separate mouse
  Display type Color TFT LCD sun readable 1200nit
  Display size 800 x 600 pixels, 12.1in. (307mm) diagonal
Operational Modes Resonance
    MIA (Mechanical Impedance Analysis)
  Freq range 250Hz to 1.5MHz
  Display Modes C-scan- Phase, Magnitude or Additive view
    Impedance plane (flying dot)= direct representation of bond tester screen
    Strip chart- rectangular real-time streaming of outputs
  Display Analysis Retrace position of all dots acquired
    Flaw sizing- length, area
    Changeable gates in post-processing, Save scan plans, user setups etc.
    Auto and user defined scaling, mm/inch units, move scanner to position
  Image Output format BMP
  Gates/ Alarms Box, ring, sectorial individually sizable gates. LED and audible alarms
Power Source Power Source Two Li-Ion batteries or AC charger (110-240V)
  Battery life 4-5 hours
Certification Certification Factory Calibration
Warranty Warranty 1 year
Compatibility Bond Testers Bondascope 3100
    Other Manufacturer's bond testers
  Scanners Manual Scanners: StringScan, SlideScan
    Automatic Scanners: CrosScan, TunnelScan

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